To prevent process defects caused by poor materials online, and time loss caused by substandard refurbished materials.

To detect defective solder paste printing products in advance and avoid them flowing into the next process.

To check whether the produced products have any errors, omissions, or defective materials flowing out of the next process.

To confirm the correctness of the assembly process on the production line and ensure that the parameters of each resistive and capacitive component are within the standard range.

Conduct spot checks on all production processes to ensure compliance with the work instructions.

To test according to the IPC610D standard, and to check for defects such as errors, omissions, and false connections in the surface mounted PCBA after welding.

To test the solder joints of components that are not visible to the naked eye, ensuring the reliability of each solder ball in BGA.

According to the IPC-610 inspection standard, inspect the finished board to ensure 99.98% of good products are shipped.

Strictly inspect before shipment and scan the code for verification to prevent unqualified products from being shipped.