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Description
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AD2428WCCSZ02-RL AD2428WCCSZ02-RL 17135 Analog Devices Inc. A2B MASTER/SLAVE 4XPDM 32-WFQFN Exposed Pad, CSP
AD2425WCCSZ-RL AD2425WCCSZ-RL 29213 Analog Devices Inc. SINGLE SLAVE SERIAL AUDIO I/F W/ 32-WFQFN Exposed Pad, CSP
SA571D SA571D 47961 onsemi IC COMPANDOR DUAL GAIN 16-SOIC 16-SOIC (0.295", 7.50mm Width)
LA72670BM-F-MPB-E LA72670BM-F-MPB-E 46550 onsemi SOUND SIGNAL PROCESSOR Bulk
FSA8029UMX FSA8029UMX 5949 Fairchild Semiconductor AUDIO JACK SEND / END DETECTION 10-UFQFN
TDA7803C-ZST TDA7803C-ZST 18360 STMicroelectronics DISCRETE Bulk
TDA7803C-ZSX TDA7803C-ZSX 14951 STMicroelectronics DISCRETE Bulk
DRV134UAE4 DRV134UAE4 25110 Texas Instruments AUDIO BALANCED LINE DRIVER OFFER 16-SOIC (0.295", 7.50mm Width)
CS6A4989 CS6A4989 28553 Canaan Semiconductor Pty Ltd Stereo Current Assisted Class-A Bulk
STK433-270-E STK433-270-E 10941 Sanyo 60W X 3-CHANNEL CLASS AB AUDIO P Bulk
DIR9001S1PWR DIR9001S1PWR 35094 Texas Instruments PROTOTYPE 28-TSSOP (0.173", 4.40mm Width)
DIR9001PWR-P DIR9001PWR-P 31969 Texas Instruments PROTOTYPE 28-TSSOP (0.173", 4.40mm Width)
DIR9001PW-P DIR9001PW-P 32770 Texas Instruments PROTOTYPE 28-TSSOP (0.173", 4.40mm Width)
AD2428WCCSZ02 AD2428WCCSZ02 45472 Analog Devices Inc. A2B MASTER/SLAVE 4XPDM 32-WFQFN Exposed Pad, CSP
NPCA110PA0YX TR NPCA110PA0YX TR 32116 Nuvoton Technology Corporation AUDIO ENHANCEMENT ENGINE OPTIMIZ 40-VFQFN Exposed Pad
NPCA120DY02 NPCA120DY02 42955 Nuvoton Technology Corporation BONGIOVI AUDIO ENHANCEMENT ENGIN -
NPCA120DD01 NPCA120DD01 20312 Nuvoton Technology Corporation BONGIOVI AUDIO ENHANCEMENT ENGIN 64-LQFP
TAS5026APAG TAS5026APAG 49184 Texas Instruments IC MODULATOR 64TQFP 64-TQFP
TEA6831HW/V106557 TEA6831HW/V106557 38688 Ampleon USA Inc. TEA6831HW - Audio Special Purpos Bulk
TAS5028APAG TAS5028APAG 7377 Texas Instruments IC MODULATOR 64TQFP 64-TQFP

Audio Special Purpose

1. What are Audio Special Purpose ICs?‌

Audio Special Purpose ICs are integrated circuits designed for audio signal processing, including core functional modules such as audio codec (CODEC), digital signal processor (DSP), amplifier, mixer, etc., covering the entire link of audio signal acquisition, conversion, processing, and output. This type of chip achieves application requirements such as high-definition voice capture and multi-channel output through analog signal input, A/D conversion, digital processing (such as noise reduction and equalization), and D/A conversion.

 

2. What are the ‌Main Types of Audio Special Purpose ICs?‌

‌Audio Codec (CODEC)

Mainly responsible for analog-to-digital conversion (ADC) and digital-to-analog conversion (DAC), which directly affects the quality of analog input and output. For example, the AC107 chip supports multi-microphone array input and is suitable for speech recognition scenarios.

 

Digital Signal Processor (DSP)

Performs complex algorithm processing on digital audio, such as filtering, sound enhancement, etc. Some high-end models integrate independent programmable microphone bias voltage and amplifier.

 

‌Automotive Audio Processor

Optimized for the in-vehicle environment, such as BD37033FV-ME2 and BD37069FV-ME2 support multi-channel output (such as 6 channels), covering power management, interface control, and other functions, and adapting to the low noise and high-reliability requirements of the automotive audio system.

 

‌Power Amplifier

Such as the LTC6910 series, it provides high driving capability and is commonly found in portable devices and consumer electronics products. It is necessary to pay attention to the packaging form (such as SOT23-8) and the power supply voltage range.

 

3. ‌Interface and Communication Protocol of Audio Special Purpose ICs‌

‌Digital Interface Type

Includes I²S (mainstream audio data transmission bus), PCM (mostly used for data conversion between subsystems), and PDM (microphone recording scenarios). Among them, I²S supports left and right channel separation transmission and can work efficiently with the main control chip.

 

‌Control Interface

Such as the I²C bus, used for parameter configuration (such as volume adjustment).

 

4. What are Audio Special Purpose ICs Used for?‌‌

‌Consumer Electronics‌: audio processing of headphones, smart speakers, mobile phones, and other devices.

‌Automotive Electronics‌: Car audio, voice assistant, etc.

‌Industry and Communications‌: Conference systems, signal processing of voice recognition equipment.

 

5. ‌Design Points for Audio Special Purpose ICs‌

‌Power Supply and Wiring‌: Short and wide power leads should be used to reduce impedance and avoid power ripple affecting sound quality.

‌Interface Layout‌: It is recommended to place peripheral interfaces such as headphone jacks on the edge of the PCB for easy plugging and unplugging. At the same time, attention should be paid to the isolation of power supply pins (such as +5V power lines to avoid misconnection).

‌Anti-interference‌: The analog signal path needs to be separated from the digital signal to reduce crosstalk.