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IP5002CX8/P,135 IP5002CX8/P,135 4206 NXP USA Inc. IC AUDIO SIGNAL PROCESSOR -
LM1972M LM1972M 31628 Texas Instruments IC VOLUME CONTROL 20SOIC 20-SOIC (0.295", 7.50mm Width)
TEA6636HW/V103CK TEA6636HW/V103CK 13836 NXP USA Inc. IC TUNER DIGITAL 1-CHIP QFP Tray
TAS5036IPFCR TAS5036IPFCR 16955 Texas Instruments IC MODULATOR 80TQFP 80-TQFP
CXD9883AMDKDR CXD9883AMDKDR 8288 STMicroelectronics IC Bulk
TAS5036IPFCRG4 TAS5036IPFCRG4 16729 Texas Instruments IC MODULATOR 80TQFP 80-TQFP
FSA95601VAHR2 FSA95601VAHR2 22663 NXP USA Inc. IC AMP 6CH CLASS D DGTL -
TEA6321T/V1,512 TEA6321T/V1,512 19441 NXP USA Inc. IC VOLUME CONTROL 32SO 32-SOIC (0.295", 7.50mm Width)
TAS5036IPFC TAS5036IPFC 15139 Texas Instruments IC MODULATOR 80TQFP 80-TQFP
TAS5028APAGG4 TAS5028APAGG4 8145 Texas Instruments IC MODULATOR 64TQFP 64-TQFP
FSA95601AHR2 FSA95601AHR2 41827 NXP USA Inc. IC AMP 6CH CLASS D DGTL -
TAS5508PAGRG4 TAS5508PAGRG4 44949 Texas Instruments IC MODULATOR 64TQFP 64-TQFP
MFA100FBD48/01QL MFA100FBD48/01QL 1113 NXP USA Inc. IC AUDIO DEVICE 48LQFP -
TAS5076PFCR TAS5076PFCR 16053 Texas Instruments IC MODULATOR 80TQFP 80-TQFP
TAS5026IPAGR TAS5026IPAGR 26046 Texas Instruments IC MODULATOR 64TQFP 64-TQFP
TAS5036IPFCG4 TAS5036IPFCG4 14580 Texas Instruments IC MODULATOR 80TQFP 80-TQFP
TAS5026PAGG4 TAS5026PAGG4 39847 Texas Instruments IC MODULATOR 64TQFP 64-TQFP
TAS5026PAGRG4 TAS5026PAGRG4 10981 Texas Instruments IC MODULATOR 64TQFP 64-TQFP
TAS5076PFCRG4 TAS5076PFCRG4 31787 Texas Instruments IC MODULATOR 80TQFP 80-TQFP
TAS5508PAGG4 TAS5508PAGG4 3398 Texas Instruments IC MODULATOR 64TQFP 64-TQFP

Audio Special Purpose

1. What are Audio Special Purpose ICs?‌

Audio Special Purpose ICs are integrated circuits designed for audio signal processing, including core functional modules such as audio codec (CODEC), digital signal processor (DSP), amplifier, mixer, etc., covering the entire link of audio signal acquisition, conversion, processing, and output. This type of chip achieves application requirements such as high-definition voice capture and multi-channel output through analog signal input, A/D conversion, digital processing (such as noise reduction and equalization), and D/A conversion.

 

2. What are the ‌Main Types of Audio Special Purpose ICs?‌

‌Audio Codec (CODEC)

Mainly responsible for analog-to-digital conversion (ADC) and digital-to-analog conversion (DAC), which directly affects the quality of analog input and output. For example, the AC107 chip supports multi-microphone array input and is suitable for speech recognition scenarios.

 

Digital Signal Processor (DSP)

Performs complex algorithm processing on digital audio, such as filtering, sound enhancement, etc. Some high-end models integrate independent programmable microphone bias voltage and amplifier.

 

‌Automotive Audio Processor

Optimized for the in-vehicle environment, such as BD37033FV-ME2 and BD37069FV-ME2 support multi-channel output (such as 6 channels), covering power management, interface control, and other functions, and adapting to the low noise and high-reliability requirements of the automotive audio system.

 

‌Power Amplifier

Such as the LTC6910 series, it provides high driving capability and is commonly found in portable devices and consumer electronics products. It is necessary to pay attention to the packaging form (such as SOT23-8) and the power supply voltage range.

 

3. ‌Interface and Communication Protocol of Audio Special Purpose ICs‌

‌Digital Interface Type

Includes I²S (mainstream audio data transmission bus), PCM (mostly used for data conversion between subsystems), and PDM (microphone recording scenarios). Among them, I²S supports left and right channel separation transmission and can work efficiently with the main control chip.

 

‌Control Interface

Such as the I²C bus, used for parameter configuration (such as volume adjustment).

 

4. What are Audio Special Purpose ICs Used for?‌‌

‌Consumer Electronics‌: audio processing of headphones, smart speakers, mobile phones, and other devices.

‌Automotive Electronics‌: Car audio, voice assistant, etc.

‌Industry and Communications‌: Conference systems, signal processing of voice recognition equipment.

 

5. ‌Design Points for Audio Special Purpose ICs‌

‌Power Supply and Wiring‌: Short and wide power leads should be used to reduce impedance and avoid power ripple affecting sound quality.

‌Interface Layout‌: It is recommended to place peripheral interfaces such as headphone jacks on the edge of the PCB for easy plugging and unplugging. At the same time, attention should be paid to the isolation of power supply pins (such as +5V power lines to avoid misconnection).

‌Anti-interference‌: The analog signal path needs to be separated from the digital signal to reduce crosstalk.